December 16, 2004
Computer Chips for US Passport
Additional Information Regarding UnitedStates Government Printing Office (GPO) Award
NEW YORK and RA'ANANA, Israel, -- SuperCom, Ltd., a leading provider of smart card and electronic identification (e-ID) solutions, announced today, following its press release of October 11, 2004 and further to the United States Government Printing Office's (GPO) news release of October 14, 2004 that the GPO has awarded contracts to four companies to provide computer chips for testing a new electronic US Passport. SuperCom, Ltd. provides innovative solutions in smart-card and e-ID technologies to the commercial and government sectors. The Company offers a wide range of standard and customized smart-card-based solutions for physical and logical security, education, corrections facilities and air & seaports. It is also a leader in the manufacturing of secure and durable documents such as national identity cards, passports, visas, drivers' licenses and vehicle registration to improve homeland security, governmental efficiency and document ease of use. Headquartered in Israel, SuperCom has subsidiaries in the US and Hong Kong. For more information, visit our website at www.supercomgroup.com.
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